首页> 外国专利> ADHESION PROMOTER FOR INTEGRALLY BONDING A POLYMERIC ORGANIC MATERIAL TO AN INORGANIC SUBSTRATE AND METHOD FOR INTEGRALLY BONDING A POLYMERIC ORGANIC MATERIAL TO AN INORGANIC SUBSTRATE BY MEANS OF THE ADHESION PROMOTER

ADHESION PROMOTER FOR INTEGRALLY BONDING A POLYMERIC ORGANIC MATERIAL TO AN INORGANIC SUBSTRATE AND METHOD FOR INTEGRALLY BONDING A POLYMERIC ORGANIC MATERIAL TO AN INORGANIC SUBSTRATE BY MEANS OF THE ADHESION PROMOTER

机译:用于将高分子有机材料整体结合到无机基质上的粘合促进剂和用于将高分子有机材料整体粘合到无机基质上的粘合促进剂的方法

摘要

The invention relates to an adhesion promoter for integrally bonding a polymeric organic material to an inorganic substrate, wherein the adhesion promoter has protected isocyanate compounds, which are represented by the following general formula: R1-(CH2)y-NH-C(O)-Z, wherein R1 is selected from the group of the silanes, phosphonates, or thiols, Z is a protective group, and y means 0 to 24.
机译:本发明涉及一种用于将聚合物有机材料整体结合到无机基材上的粘合促进剂,其中该粘合促进剂具有被保护的异氰酸酯化合物,其由以下通式表示:R 1 -(CH < Sub> 2 y -NH-C(O)-Z,其中R 1 选自硅烷,膦酸酯或硫醇, Z为保护基,y为0至24。

著录项

  • 公开/公告号WO2016113240A1

    专利类型

  • 公开/公告日2016-07-21

    原文格式PDF

  • 申请/专利权人 SEMPERIT AG HOLDING;

    申请/专利号WO2016EP50437

  • 申请日2016-01-12

  • 分类号C07C265/04;C08G18/71;C08G18/28;C08G18/80;C09D175/04;C08K5/5353;C08K5/5455;C08K9/04;C08K9/06;

  • 国家 WO

  • 入库时间 2022-08-21 14:17:12

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号