METHOD FOR BONDING POLYMER FILM AND POLYMER FILM METHOD FOR BONDING POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE POLYMER FILM LAMINATE AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE

摘要

The present invention provides a method of strongly and at low cost bonding a polymer film to another polymer film or glass substrate at low temperature without using an organic adhesive. The method of bonding the polymer film is a step (S1) of forming a first inorganic material layer on part or all of the first polymer film, and a step of forming a second inorganic material layer on part or all of the second polymer film (S3). ), Step S2 of surface activation processing by colliding the surface of the first inorganic material layer with particles having a predetermined kinetic energy, and colliding the surface of the second inorganic material layer with particles having a predetermined kinetic energy The step (S4) of surface activation treatment by contacting, and the surface of the first inorganic material layer subjected to surface activation is brought into contact with the surface of the surface activated second inorganic material layer to bond the first polymer film and the second polymer film. It has step S5.