Method of forming a microelectronic assembly with a particulate free underfill material and a microelectronic assembly incorporation the same

摘要

A microelectronic assembly (10) incorporating a particulate free underfill material (32 includes a substrate (24) having a plurality of bond pads (26) disposed on a substantially planar die attach region (24), and an integrated circuit die (12) having a die face (16) and a plurality of bond pads (20). The die face (16) is superimposed over the substrate die attach region (24) so that each of the die face bond pads (20) is generally aligned with a corresponding one of the substrate bond pads (26) and such that the die face is spaced apart from the die attach region by a gap not greater than about 20 microns. Each of the die face bond pads (20) is connected to its corresponding one of the substrate bond pads (26) by a solder connection (30). A particulate free polymeric material (32) is disposed in the gap, with the polymeric material substantially encapsulating each of the solder connections.