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Process and apparatus for bonding a pair of ducts together in which a removable member is used to help support and maintain alignment between the ducts during bonding
Process and apparatus for bonding a pair of ducts together in which a removable member is used to help support and maintain alignment between the ducts during bonding
The present invention provides a method of joining a mating face of a first through duct to a mating face of a second duct. Specifically, the method includes bonding the first duct mating face to the second duct mating face to form a bonded structure while the ducts are supported in alignment with each other on an alignment member. Once so bonded, the alignment member may be removed from the bonded structure. Advantageously, the method of the present invention provides an approach for accurately joining ducts together such that the joint is clean, accurate, nondistorted, durable, and impermeable to metal ions. Furthermore, the resultant joints are extremely uniform, and are easy and economical to make using simple equipment, thus making the present invention particularly useful in mass production.
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