WAVE SOLDERING PROCESS INCLUDING DRY FLUXING AND DEVICE THEREFOR

摘要

The invention relates to a method of wave soldering a circuit using a solder alloy, in which the circuit is brought into contact with at least one wave of liquid solder, obtained by pumping. of a liquid bath of the solder alloy, contained in a tank, through a nozzle, characterized in that, beforehand, each of the faces of the circuit has been brought to a pressure close to atmospheric pressure opposite the gas outlet of at least one apparatus for forming excited or unstable gaseous species through which an initial gas mixture comprising an inert gas and / or a reducing gas and / or an oxidizing gas is passed, in order to obtain at the gas outlet from the apparatus, a primary gas mixture comprising excited or unstable species and substantially free of electrically charged species.