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Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
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机译:紫外激光切割或脆性高熔点目标材料(例如陶瓷或玻璃)的形状修改
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摘要
A UV laser (102) cuts ceramics or glasses such as the alumina or ceramic of sliders (10), and particularly separates rows (60) or sliders (10) or rounds edges (66, 82, 86). A preferred process entails covering the surfaces of wafers (50), rows (60), or sliders (10) with a sacrificial layer; removing a portion of the sacrificial layer to create uncovered zones along existing edges or over intended edges; laser cutting wafers (50) into rows (60) or rows (60) into sliders (50); laser rounding edges (66, 68, 82, 84, and/or 86), and/or corners (85 and/or 87); cleaning debris from the uncovered zones; and removing the sacrificial layer. Although a preferred laser is a Q-switched, UV solid-state laser (100) providing imaged and/or shaped output at a bite size of between about 1 to 7 mum, other lasers including excimers can be employed.
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