METHOD FOR ADJUSTING RAPID THERMAL PROCESSING (RTP) RECIPE SETPOINTS BASED ON WAFER ELECTRICAL TEST (WET) PARAMETERS

摘要

A method is provided, the method comprising measuring at least one parameter characteristic of processing performed on a workpiece (100) in a processing step, and modeling the at least one characteristic parameter measured using a correlation model. The method also comprises applying the correlation model to modify the processing performed in the processing step.