The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces, detachable fibres and leadframes. The TO-can/encapsulating element enables the optical fibre (9) to be readily positioned relative to the chip (25) with the aid of a fix-able can-flange (7), and eliminates the risk of crack formation by virtue of the component leads of said TO-can having been provided with and connected to a leadframe (6).
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