DEVICE AND METHOD FOR EVALUATING RELIABILITY OF METALLIC INTERCONNECTION AND RECORDED MEDIUM ON WHICH EVALUATION OF RELIABILITY OF METALLIC INTERCONNECTION IS RECORDED

摘要

Estimation related to void formation and failure is performed through numerical simulation using governing parameters for EM damage in a metal interconnect. During the numerical simulation, a metal interconnect is divided into elements. Current density and temperature distributions are obtained using numerical analysis (S304). Atomic flux divergence, AFDgen, of each element and the distribution thereof are calculated (S308) by using material property constants determined in advance through acceleration testing (S306). The reduction of element volume (S312) per one calculation step in the simulation is found by multiplying (S310) the volume of each element, the length of time by one calculation step, and the atomic volume corresponding to the calculated AFDgen. Based on the reduced amount of element volume, the thickness of each element decreases (S314). The elements having a decrease in thickness show the fact that voids have formed. The numerical analysis of the current density and temperature distributions in the metal interconnect is once again performed (S304) considering the thickness of each element. Calculation is iterated. IMAGE