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HIGH PEEL STRENGTH HIGH HOLDING POWER HOT MELT DISPOSABLES ADHESIVE COMPOSITION

机译:高剥离强度,高保持力,热熔性一次性胶粘剂组成

摘要

The present invention relates to a hot melt adhesive composition, which is especially suited for use in disposables, and is comprised of: a) 100 parts by weight of a blend of: i) a linear block copolymer of the formula: A-B-A-D and/or A-B-A, wherein A is a vinyl aromatic hydrocarbon polymer block having a weight average molecular weight of from 4000 to 35.000, B is a hydrogenated polydiene polymer block having a weight average molecular weight of from 20.000 to 200.000, D, if present, is a hydrogenated or unhydrogenated polydiene polymer block having a weight average molecular weight of from 3000 to 50.000, wherein the ratio of the molecular weight of D to the molecular weight of B is no more than 0.5 and the copolymer has a vinyl aromatic hydrocarbon content of from 9 to 35 percent by weight; and ii) an unhydrogenated vinyl aromatic hydrocarbon-diene diblock copolymer having a weight average molecular weight of 10.000 to 50.000 and a poly(vinyl aromatic hydrocarbon) content of from 10 to 40 % by weight, wherein the diblock copolymer comprises from 10 to 35 % by weight of the blend, and b) 100 to 275 parts by weight of a tackifying resin which is compatible with the diene blocks, and c) 0 to 80 parts of a plasticizer. The present invention further relates to a specific linear block copolymer of formula A-B-A-D.
机译:热熔粘合剂组合物本发明涉及一种热熔粘合剂组合物,其特别适合用于一次性使用,并且包括:a)100重量份的以下混合物:i)下式:ABAD的线性嵌段共聚物和/或ABA,其中A为重均分子量为4000至35.000的乙烯基芳烃聚合物嵌段,B为重均分子量为20.000至200.000的氢化聚二烯聚合物嵌段,D(如果存在)为氢化的或重均分子量为3000至50.000的未氢化聚二烯聚合物嵌段,其中D的分子量与B的分子量之比不超过0.5,并且共聚物的乙烯基芳烃含量为9至35%(重量); ii)重均分子量为10.000至50.000,聚(乙烯基芳烃)含量为10至40重量%的未氢化乙烯基芳族烃-二烯二嵌段共聚物,其中该二嵌段共聚物占10%至35% (b)100-275重量份与二烯嵌段相容的增粘树脂,和c)0-80重量份增塑剂。本发明进一步涉及式A-B-A-D的特定线性嵌段共聚物。

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