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A METHOD AND AN ARRANGEMENT FOR THE ELECTRICAL CONTACT OF COMP0NENTS
A METHOD AND AN ARRANGEMENT FOR THE ELECTRICAL CONTACT OF COMP0NENTS
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机译:组件电接触的方法和安排
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摘要
The present invention relates to a method for connecting an element such as a chip 6 on a substrate 7 to a conductive surface of a carrier such as a ground plane 10 on a printed circuit board 8 having a conductive layer 11 in a so-And apparatus.
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