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A METHOD AND AN ARRANGEMENT FOR THE ELECTRICAL CONTACT OF COMP0NENTS
A METHOD AND AN ARRANGEMENT FOR THE ELECTRICAL CONTACT OF COMP0NENTS
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机译:组件电接触的方法和安排
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摘要
A method and an arrangement for connecting a component, such as a chip (6), on a substrate (7) to a conductive surface of a carrier. The conductive surface can be an earth plane (10) and the carrier can be a printed circuit board. The method and arrangement allow the component to thermally conduct and/or electrically conduct onto the conductive surface.
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