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Process for production of thin film semiconductor thin film semiconductor device process for production of semiconductor thin film and apparatus for production of semiconductor thin film

机译:薄膜半导体薄膜的制造方法半导体器件半导体薄膜的制造方法和半导体薄膜的制造装置

摘要

PURPOSE: A method for manufacturing a thin film, a semiconductor thin film, a semiconductor device, a method for manufacturing a semiconductors thin film, and a system for manufacturing a semiconductor thin film are provided to manufacture a thin film, especially a semiconductor thin film, in which volatile gases, e.g. hydrogen, in a thin film can be reduced just like a case employing an electric furnace without sacrifice of productivity while preventing breakage of the film. CONSTITUTION: A thin film(2) containing volatile gas is irradiated with excimer laser light(5) having pulse width of 60 nS or longer thus degassing the thin film. The thin film(2) can be protected against breakage even if it is re-crystallized subsequently and short time processing is realized by excimer laser irradiation. Alternatively, a thin film containing 2 atm.% or more of volatile gas is irradiated with excimer laser having pulse width of 60 nS or longer thus degassing the thin film(2) while crystallizing. Since nuclei are formed uniformly, size of crystal particles is made uniform and variations of characteristics are suppressed.
机译:目的:提供一种薄膜的制造方法,一种半导体薄膜,一种半导体器件,一种用于制造半导体薄膜的方法以及一种用于制造半导体薄膜的系统,以制造薄膜,尤其是半导体薄膜。 ,其中含有挥发性气体,例如如同使用电炉的情况一样,可以减少薄膜中的氢,而又不损失生产率,同时防止薄膜破裂。组成:用脉冲宽度为60 nS或更长的准分子激光(5)照射含有挥发性气体的薄膜(2),从而使薄膜脱气。即使随后将其再结晶,也可以保护薄膜(2)免于破裂,并且通过准分子激光辐照实现短时间的处理。或者,用脉冲宽度为60nS或更长的准分子激光照射包含2atm。%或更多的挥发性气体的薄膜,从而在结晶的同时使薄膜(2)脱气。由于核均匀地形成,所以晶体颗粒的大小均匀并且特性的变化得到抑制。

著录项

  • 公开/公告号KR20020019419A

    专利类型

  • 公开/公告日2002-03-12

    原文格式PDF

  • 申请/专利权人 SONY CORPORATION;

    申请/专利号KR20010054335

  • 申请日2001-09-05

  • 分类号H01L29/786;

  • 国家 KR

  • 入库时间 2022-08-22 00:31:22

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