Composition Methods of Forming Low-Permittivity Film from the Composition Low-Permittivity Film and Electronic Part Having the Low-Permittivity Film

摘要

The present invention provides a composition comprising (a) a thermally decomposable polymer and (b) a siloxane oligomer which is uniformly dissolved in an organic solvent, (c) a thermally decomposable polymer, (b) a siloxane oligomer, And (b) are dissolved in an organic solvent; and the composition is applied to a substrate to form a composite film in which a thermally decomposable polymer and a siloxane oligomer are uniformly mixed with each other, and then the condensation reaction of the siloxane oligomer A method for forming a low-dielectric-constant film, comprising the steps of: applying the composition to a substrate to form a composite film in which a thermally decomposable polymer and a siloxane oligomer are uniformly mixed with each other; Characterized in that a first heating step of crosslinking the siloxane oligomer and a second heating step of removing the thermally decomposable polymer are carried out, Forming method, this provides an electronic device having a low dielectric constant film and the low dielectric constant film formed by a low dielectric constant film forming method.