BEVELING WHEEL FOR PROCESSING OUTER CIRCUMFERENCE PART OF SILICONE WAFER AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: To provide conductivity to adhesive agent for fixing an abrasive grain layer, employ a base metal of light metal or light metal alloy, and reduce weight of a beveling wheel in the beveling wheel for machining an outer circumferential part of a silicone wafer in which the abrasive grain layer provided with one or plural grooves are formed is fixed to an outer circumferential part of the base metal. CONSTITUTION: The abrasive grain layer 2a in a circular form is manufactured comprising metal bond or conductive resin bond as binder using a die, the abrasive grain layer 2a is fixed to the outer circumferential part of the base metal 1 of aluminum or aluminum alloy through the adhesive agent 4 having conductivity, and one or plural grooves 3 are formed in the abrasive grain layer 2a by electric discharge machining to be the beveling wheel 10.