Cooling rail for direct fluid cooling of circuit modules, has at least one quiet zone, at least one slot and at least one chamber through which the cooling fluid flows

摘要

The module has a semiconducting element on a thermally conducting, electrically insulating substrate, especially a ceramic substrate, which is attached at its lower surface to a base plate, especially by a metal bearer plate, that is cooled. The cooling rail has at least one quiet zone (2), at least one slot (3) and at least one chamber (4) through which the cooling fluid flows. Independent claims are also included for the following: a circuit module, especially a semiconducting module, power semiconducting module or similar.