Polymer stud grid array and method for producing such a polymer stud grid arrays

摘要

On a substrate (s), a first wiring layer (v1) and metallized interconnection holes (d) is formed. On the upper side (o1) of the substrate (s) is then applied by injection molding a substrate layer (sl) is applied, wherein the material by the via holes (d), passes and on the underside (u) of the substrate (s) over the area (ps) are formed. A on the substrate layer (sl) formed second wiring layer (v2) is connected via blind hole - plated-through holes (sd) with the first wiring layer (v1) and thus, by means of the interconnection holes (d) to external terminals (aa) on the polymer studs (ps) electrically conductively connected.