Method and device for producing a multilayer structure for a printed circuit board rolls on a liquid hardening insulation coating on one side of a base board while applying a conductive foil to the coating before hardening.

摘要

A foil-applying device (1) has a hollow foil-applying roller (HFAR) (6) with a perforated peripheral wall to apply foil (7) onto one side of a printed circuit board (5). The HFAR can be evacuated in a roller area (8) between a contact point or a first peripheral location (9) on the HFAR matching a roller contact point for applying the foil, which rolls off a foil roller (11) and feeds the HFAR.