Liquid-cooling device for high-power semiconductor module, has housing with cooling surface and enclosing a liquid-flowed space

摘要

A liquid cooling device for a high-power semiconductor module having a number of heat-generating sub-modules each of which has at least one semiconductor component mounted on an electrically insulating ceramic substrate(1). The housing consists of a housing part (4) and a cooling surface (3) and encloses a liquid-flowed space, and is formed by the trough-shaped part (4) which contains a stabilizing device (5) which is joined by means of hard-solder joints at each point of contact with the housing (3;4). The cooling surface (3) likewise is fixed by means of hard-solder joints to the housing part (4).