Method and device for separating single crystals, adjusting device and test method for determining an orientation of a single crystal for such a method

摘要

The invention relates to a method for cutting single crystals, especially GaAs single crystals. According to the invention, a single crystal (1) to be cut into at least two parts and a cutting tool (2, 3; 8, 8a, 8b, 8c) can be moved in relation to each other in an advance direction (V), the single crystal (1) being oriented in such a way that a defined crystallographic direction (K) can be found in the cutting plane (T). The inventive method is characterised in that an angle rho between the defined crystallographic direction (K) and the advance direction (V) is chosen in such a way that forces acting on the cutting tool perpendicularly to the cutting plane during the cutting process compensate for each other.