Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation

摘要

The present invention relates to a method for severing single crystals (1), especially GaAs single crystals by cutting. According to the invention, a single crystal (1) to be cut into at least two parts and a cutting tool (2, 8) can be moved in relation to each other in an advance direction (V), the single crystal (1) being oriented in such a way that a defined crystallographic direction (K) can be found in the cutting plane (T). The inventive method is characterised in that an angle (ro) between the defined crystallographic direction (K) and the advance direction (V) of the cutting tool (2, 8) is chosen in such a way that forces acting on the cutting tool (2, 8) perpendicularly to the cutting plane (T) during the cutting process compensate for each other.