首页> 外国专利> Producing circuit structures on semiconducting substrate involves combining first dummy structure with second to exceed minimum size if envisaged structure smaller than minimum

Producing circuit structures on semiconducting substrate involves combining first dummy structure with second to exceed minimum size if envisaged structure smaller than minimum

机译:在半导体衬底上生产电路结构包括将第一虚拟结构与第二虚拟结构组合起来,以使结构小于最小尺寸

摘要

The method involves using a lithographic process, whereby photo-lacquer structures are formed on the semiconducting substrate (5) to define dummy circuit structures. If an envisaged dummy structure (4) is smaller than a minimum size determined by the smallest required adhesive surface for photo-lacquer the first dummy structure is combined with a second to exceed the minimum size. An independent claim is also included for the following: a semiconducting substrate with functional circuit structures and dummy structures.
机译:该方法包括使用光刻工艺,由此在半导体衬底(5)上形成光漆结构以限定虚设电路结构。如果设想的虚设结构(4)小于由光漆所需的最小所需粘合表面确定的最小尺寸,则将第一虚设结构与第二虚设结构组合以超过最小尺寸。还包括以下方面的独立权利要求:具有功能电路结构和虚设结构的半导体衬底。

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