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Producing circuit structures on semiconducting substrate involves combining first dummy structure with second to exceed minimum size if envisaged structure smaller than minimum
Producing circuit structures on semiconducting substrate involves combining first dummy structure with second to exceed minimum size if envisaged structure smaller than minimum
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机译:在半导体衬底上生产电路结构包括将第一虚拟结构与第二虚拟结构组合起来,以使结构小于最小尺寸
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摘要
The method involves using a lithographic process, whereby photo-lacquer structures are formed on the semiconducting substrate (5) to define dummy circuit structures. If an envisaged dummy structure (4) is smaller than a minimum size determined by the smallest required adhesive surface for photo-lacquer the first dummy structure is combined with a second to exceed the minimum size. An independent claim is also included for the following: a semiconducting substrate with functional circuit structures and dummy structures.
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