首页> 外国专利> Manufacture of contactless chip card with coil antenna, surrounds chip with cast dam which is subsequently filled to complete chip encapsulation

Manufacture of contactless chip card with coil antenna, surrounds chip with cast dam which is subsequently filled to complete chip encapsulation

机译:带有线圈天线的非接触式芯片卡的制造,将芯片包裹在浇铸坝周围,随后将其填充以完成芯片封装

摘要

Dam (11) is attached to the support sheet (2), surrounding the chip at given spacing from it. This forms a reservoir which is subsequently filled with a cast mass (10). An Independent claim is included for the corresponding chip card. Preferred features: The chip is set onto the support sheet in the wafer state. The dam is coated onto the support sheet using an injection unit and dosing needle. Height of application is no less than that of the chip, and it is formed by a dense fluid mass, which hardens. A second injection unit and needle fill the reservoir, using an inviscid mass. The volume is such that underfilling results. The second needle is raised above the chip to complete encapsulation. The casting mass is an adhesive or resin; it may be hardened by UV light. A further sheet is applied to the support sheet with the chip, dam and cast mass. The sheet has a recess for the chip, dam and cast mass. The sheet is welded or stoved to bond it to the support sheet.
机译:坝(11)被附接到支撑片(2),以与晶片的给定间隔围绕晶片。这形成储槽,其随后填充有铸块(10)。相应的芯片卡包括独立索赔。优选特征:芯片以晶片状态放置在支撑板上。使用注射单元和计量针将挡板坝涂在支撑板上。应用的高度不小于芯片的高度,它是由致密的流体团块形成的,该团块会硬化。第二个注射单元和针头使用无粘性物质填充储液器。体积如此之大,以致于未充分填充。将第二个针抬高到芯片上方以完成封装。浇铸料是粘合剂或树脂。它可能会被紫外线硬化。将另一片施加到具有碎屑,坝和浇铸物的支撑片上。该薄板具有用于切屑,坝和铸件的凹槽。将该板焊接或烘烤以将其粘结到支撑板上。

著录项

  • 公开/公告号DE10054873A1

    专利类型

  • 公开/公告日2002-05-29

    原文格式PDF

  • 申请/专利权人 MADA MARX DATENTECHNIK GMBH;

    申请/专利号DE2000154873

  • 发明设计人 MARX GUENTER;

    申请日2000-11-06

  • 分类号G06K19/077;B29C45/14;H05K1/18;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:21

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