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Flat electronic unit for mechatronic module, has electronic component with contacts in contact with conducting tracks, and body in circuit board opening flush with substrate surface

机译:用于机电一体化模块的扁平电子单元,其电子部件的触点与导电轨接触,电路板上的本体开口与基板表面齐平

摘要

The unit has a circuit board (1) with a substrate (11) with conducting tracks (112) on at least one surface, an opening (113) in the substrate, at least one electronic component (2) with contacts (21) in electrical contact with the conducting tracks and that mechanically fix the component and a body (22) arranged essentially in the opening and essentially flush with the substrate surface (111). Independent claims are also included for the following: a mechatronic module with an inventive unit in a housing.
机译:该单元具有电路板(1),其具有在至少一个表面上具有导电轨道(112)的基板(11),基板中的开口(113),至少一个具有触点(21)的电子部件(2)。导电轨道与导电轨道电接触,并且机械地固定部件和主体(22),主体(22)基本上布置在开口中并与基板表面(111)基本齐平。还包括以下独立权利要求:在外壳中具有本发明单元的机电模块。

著录项

  • 公开/公告号DE10063241A1

    专利类型

  • 公开/公告日2002-09-05

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE2000163241

  • 发明设计人 KNOPP CARSTEN;LICKA PETR;

    申请日2000-12-19

  • 分类号H05K1/18;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:16

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