Electronic component with semiconducting chip(s) has bearer substrate with at least sectionally parallel conducting tracks on surface facing chip(s) in contact with chip contact surfaces

摘要

The device has at least one semiconducting chip (4) and a bearer substrate (6) for accepting and electrically contacting the chip(s), whereby the bearer substrate has at least sectionally parallel conducting tracks (64) on its surface facing the chip(s) and in contact with chip contact surfaces (43). Each track is available for connection over approximately its entire length. AN Independent claim is also included for the following: a method of manufacturing an inventive device.