A - chip - microcomputer with dynamic baking - test function and dynamic baking - test method therefor

摘要

In a - chip - microcomputer, the a nonvolatile semiconductor memory - component (11a, 11b) as well as read -, read - and quenching - circuits (12a, 12b, 13a, 13b, 14a, 14b) for performing a write operation, a read operation, or of an extinguishing process on the non-volatile semiconductor memory - component, is a sequencer (15a, 15b) between the read -, read - and - circuits lactam and an interface (14a, 16b) is connected to the. The sequencer via the interface receives first data from the outside, around the first data in the non-volatile semiconductor memory - component to writing, reads the first data from the non-volatile semiconductor memory - component, compares the first data with via the interface second data read from the outside, and in this way leads a verification of the nonvolatile semiconductor memory - component by, and reads third data from the non-volatile semiconductor memory - component and transmits the third data via the interface according to the outside.