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elektoplattierungsformulierung and process of iron plated directly on aluminum or aluminum alloys

机译:电镀和直接在铝或铝合金上电镀铁的工艺

摘要

An electroplating formulation and process that employs an iron plating/activating bath which acts as both a chemical activation bath to activate the aluminum or aluminum alloy substrate and acts as an electroplating bath for depositing a hard iron layer directly onto the aluminum or aluminum alloy substrate. No separate activation bath, no transitory layers, and no separate undercoating layers are needed. The activation/electroplating bath solution includes the following: (1) Fe+2 having a concentration ranging from about 0.65 to about 2.5 moles per liter of solution; (2) at least one anion associated with the Fe+2 ion; (3) a reducing agent in an amount sufficient to prevent oxidation of Fe+2 to Fe+3; (4) Cl- in an amount sufficient to promote dissolution of the anode and increase the conductivity of the solution; and (5) a wetting agent in an amount sufficient to prevent pitting of the aluminum electroplated surface. The surface of the aluminum or aluminum alloy substrate cathode is activated by immersing the cathode in the solution. An anode is also immersed in the solution. The iron layer is electroplated directly onto the activated aluminum or aluminum alloy surface of the cathode in the bath solution.
机译:一种电镀配方和方法,其采用铁电镀/活化浴,该电镀浴/活化浴既用作化学活化浴以活化铝或铝合金基材,又用作电镀浴以将硬铁层直接沉积在铝或铝合金基材上。不需要单独的活化浴,不需要过渡层,也不需要单独的底涂层。活化/电镀浴溶液包括:(1)Fe + 2的浓度范围为每升溶液约0.65至约2.5摩尔;和(2)与Fe +2离子缔合的至少一种阴离子; (3)还原剂,其量足以防止Fe +2氧化成Fe +3; (4)Cl-的量足以促进阳极的溶解并增加溶液的电导率; (5)润湿剂,其量应足以防止电镀铝表面的点蚀。通过将阴极浸入溶液中来活化铝或铝合金基底阴极的表面。阳极也浸入溶液中。在镀液中将铁层直接电镀到阴极的活化铝或铝合金表面上。

著录项

  • 公开/公告号DE69900538D1

    专利类型

  • 公开/公告日2002-01-17

    原文格式PDF

  • 申请/专利权人 BRIGGS & STRATTON CORP. WAUWATOSA;

    申请/专利号DE1999600538T

  • 发明设计人 CIMERMANCIC A.;DALLMAN J.;

    申请日1999-02-01

  • 分类号C25D3/20;C25D5/30;

  • 国家 DE

  • 入库时间 2022-08-22 00:24:43

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