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Electromagnetic, especially infrared, radiation detector has reading circuit connected electrically to the detection circuit by indium or tin/lead alloy microspheres

机译:电磁辐射探测器,尤其是红外辐射探测器,其读取电路通过铟或锡/铅/铅合金微球与检测电路电连接

摘要

Electromagnetic, especially infrared, detector comprises a radiation detection circuit (8) optionally on a support, and a reading circuit (7) connected electrically to the detection circuit on a substrate (21). The circuits are connected to each other by indium or tin/lead alloy microspheres, which alone occupy the connection zone between the circuits. Preferred Features: The support (21) for the radiation detection unit is transparent to the radiation or absorbs it to a limited extent. The reading circuit (7) is intended for processing some of the electrical signals emitted by the detection circuit, and is connected to a monolithic germanium substrate (21), which, in turn, is connected directly or indirectly to a cold source. An Independent claim is given for a method for production of the electromagnetic, particularly infrared, radiation detector described above. The method involves reducing the thickness of the reading circuit (7) before or after connecting it to the detection circuit (8), providing a reading circuit substrate (21) able to withstand stress, in order to limit the effects of thermal expansion resulting from both linear deformation and bending operating at the level of the reading circuit during different temperature cycles, and connecting the reading circuit (7) to the detection circuit (8) without using adhesives or filling materials in the connection zone. The reading circuit (7) is connected to the substrate (21) by an epoxy adhesive.
机译:电磁检测器,尤其是红外线检测器,包括辐射检测电路(8),该辐射检测电路(8)可选地位于支撑物上;以及读取电路(7),其与基板(21)上的检测电路电连接。电路通过铟或锡/铅合金微球相互连接,它们单独占据电路之间的连接区域。优选特征:用于辐射检测单元的支撑件(21)对于辐射是透明的或在一定程度上吸收辐射。读取电路(7)用于处理由检测电路发出的一些电信号,并且连接到整体式锗衬底(21),该整体式锗衬底又直接或间接地连接到冷源。给出了一种用于制造上述电磁辐射探测器,尤其是红外辐射探测器的方法的独立权利要求。该方法包括在将读取电路(7)连接到检测电路(8)之前或之后减小读取电路(7)的厚度,提供能够承受应力的读取电路基板(21),以便限制由温度引起的热膨胀的影响。在不同的温度周期内,线性变形和弯曲都在读取电路的水平上进行,并且在连接区域中不使用粘合剂或填充材料的情况下将读取电路(7)连接到检测电路(8)。读取电路(7)通过环氧粘合剂与基板(21)连接。

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