Method for transfer of chip on support, includes fastening of wafer by adhesive to provisional rigid support, cutting, detaching and fastening of chips by adhesive to final supports

摘要

The method includes the fastening of a wafer comprising chips (6) to a provisional rigid support (4) by the intermediary of an adhesive layer (3), the cutting of the wafer and the adhesive layer to obtain individual chips each with an adhesive layer, the removal of chips with adhesive layers from the provisional rigid support, and the transfer and fastening of chips on final supports by activating the adhesive. The rear surface of wafer is fastened to the provisional rigid support by the transfer adhesive. The transfer adhesive is such that the adhesion is higher to the wafer than to the provisional rigid support, in the ratio of at least 10:1, and preferentially in the range 10:1 - 50:1. The transfer adhesive is degradable by UV-radiation and the rigid support is transparent to UV-radiation. The adhesive comprising a degradable adhesive is applied to the adjacent surface of the rigid support in the form of a layer or film, or comprises the degradable adhesive at least at the level of the adjacent surface. The adhesion is degraded by use of UV-radiation before the individual chips are removed from the rigid support. The rigid support is separated from the chips by delamination, and the wafer is cleaned before cutting.