Production of a flip-chip module, comprises placing chip on a continuously moving support using an adhesive, and applying a pressure to the chips on the support until the adhesive is hardened

摘要

Production of a flip-chip module comprises placing chip on a continuously moving support using an adhesive; and applying a pressure to the chips on the support until the adhesive is hardened using a pressing tool with mechanical pressing devices which are moved within a zone synchronously with the support. An Independent claim is also included for a device for the production of a flip-chip module comprising units for applying an adhesive on a continuously moving support (2); units for placing the chips (1) on the support; mechanical pressing tools with mechanical pressing units (7) for applying a pressure to the chips on the support to harden the adhesive; and units (5, 6, 8) for synchronously moving the pressing tools with the support within a zone.