Production of a contact-less chip support comprises laminating an insulating film on a micro-module film, laminating an adhesive film on the micro-module film, cutting the micro-module and applying an antenna to each micro-module

摘要

Production of a contact-less chip support comprises: (a) laminating an insulating film (3) on a micro-module film; (b) laminating a film made from electrically conducting thermally active adhesive on the micro-module film; (c) cutting the micro-module (2); and (d) applying an antenna (11) to each micro-module. Production of a contact-less chip support comprises: (a) laminating an insulating film (3) on a micro-module film; (b) laminating a film made from electrically conducting thermally active adhesive on the micro-module film; (c) cutting the micro-module (2); and (d) applying an antenna (11) to each micro-module. The lower side of the micro-module supports the insulating layer and the adhesive layer (5) and faces the antenna so that an electrical connection to the connections (12) of the antenna is formed.