首页> 外国专利> Integrated circuit semiconductor slice manufacture/method apparatus having support substitute/slice crystalline structure having structure orientation window assembled with viewing sections separated.

Integrated circuit semiconductor slice manufacture/method apparatus having support substitute/slice crystalline structure having structure orientation window assembled with viewing sections separated.

机译:具有支撑替代物/切片晶体结构的集成电路半导体切片制造/方法设备,所述载体替代物/切片晶体结构具有组装有观察部分的结构定向窗口。

摘要

The semiconductor slice manufacture method has two semiconductor sections with notch edge viewing sections (1a,3a) showing the crystalline orientations. The crystalline viewing orientation notch indicates the same crystalline orientation position. The crystalline sections are assembled with the viewing sections separated one from the other.
机译:半导体切片的制造方法具有两个半导体部分,其具有显示结晶取向的切口边缘观察部分(1a,3a)。结晶观察取向切口表示相同的结晶取向位置。结晶部分组装在一起,观察部分彼此分开。

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