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Integrated circuit semiconductor slice manufacture/method apparatus having support substitute/slice crystalline structure having structure orientation window assembled with viewing sections separated.
Integrated circuit semiconductor slice manufacture/method apparatus having support substitute/slice crystalline structure having structure orientation window assembled with viewing sections separated.
The semiconductor slice manufacture method has two semiconductor sections with notch edge viewing sections (1a,3a) showing the crystalline orientations. The crystalline viewing orientation notch indicates the same crystalline orientation position. The crystalline sections are assembled with the viewing sections separated one from the other.
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