首页> 外国专利> One-dimensional nanostructure manufacturing method, especially for nano-electronics, forming parallel atomic lines on substrate with conducting or insulating strips between them

One-dimensional nanostructure manufacturing method, especially for nano-electronics, forming parallel atomic lines on substrate with conducting or insulating strips between them

机译:一维纳米结构的制造方法,特别是用于纳米电子学的方法,在衬底上形成平行原子线,并在它们之间形成导电或绝缘条

摘要

Parallel atomic lines (4), preferably of silicon, are formed on the surface of a silicon carbide substrate (2). The silicon carbide preferably has a cubic structure and the deposition surface is a (100) surface. Material capable of being selectively absorbed between the atomic lines, but not by the lines themselves, is then deposited to create passivated (6) or conductive (8) strips of the material between the lines. The deposited material may be hydrogen, oxygen,or any other molecule enabling passivation of the underlying surface, e.g. NO, N2O, N2, NH3, or sulfur. To produce conductive strips a metal may be chosen from the groups of alkaline or transition metals. An Independent claim is included for nanostructures produced using the method.
机译:优选地由硅制成的平行原子线(4)形成在碳化硅衬底(2)的表面上。碳化硅优选具有立方结构,并且沉积表面是(100)表面。然后沉积能够被原子线之间而不是被原子线自身选择性吸收的材料,以在原子线之间形成材料的钝化(6)或导电(8)条。沉积的材料可以是氢,氧或能够钝化下面的表面的任何其他分子,例如硅。 NO,N2O,N2,NH3或硫为了生产导电条,可以从碱金属或过渡金属的组中选择金属。独立权利要求包括使用该方法生产的纳米结构。

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