Curable flux, solder joint resist, semiconductor package reinforced by hardenable flux, semiconductor device, and manufacturing method of semiconductor package and semiconductor device

摘要

A hardenable flux that acts as a flux during solder bonding, then heated, and hardened as a reinforcing material of the solder joint, a hardened flux, solder resist resist, and a hardenable flux are applied to the circuit exposed surface to bond solder balls After that, the semiconductor package is reinforced with a solder ball junction by further heated and hardened flux, and the hardenable flux is applied to a semiconductor mounting substrate having solder bonding Landes and solder bonded and then heated A semiconductor device in which a solder joint is reinforced by a hardened flux, and the package and method of manufacturing the same. When the semiconductor package is bonded to the semiconductor mounting substrate by soldering, it acts as a flux, and is heated by further heating after the solder bonding, hardened flux which is a reinforcing material for the solder joint, resist for solder bonding, and the hardness thereof Semiconductor package and semiconductor device reinforced by caustic flux and semiconductor package and semiconductor deviceConstruction method.