首页> 外国专利> RESIN MATRIX FOR CHEMICAL EMBOSSING AND METHOD FOR PRODUCING CHEMICALLY EMBOSSED, CALENDERED NONHALOGEN RESIN SHEET

RESIN MATRIX FOR CHEMICAL EMBOSSING AND METHOD FOR PRODUCING CHEMICALLY EMBOSSED, CALENDERED NONHALOGEN RESIN SHEET

机译:用于化学压花的树脂基体和制备化学压印的,压延的无卤树脂板的方法

摘要

PROBLEM TO BE SOLVED: To provide a resin matrix for chemical embossing; a method for producing a chemically embossed, calendered nonhalogen resin sheet; especially, a nonhalogen flooring material which is enhanced in three-dimentional feeling, quality feeling and design effect by the development of the so-called chemical embossing synchronizing foamed and non-foamed parts to a pattern.;SOLUTION: This resin matrix for chemical embossing comprises a nonhalogen resin of which the melt viscosity at 200°C is 5,000-8,000 (Pa.s) at a shear rate of 10 (1/S) and the melt tension at 200°C is 5-10 (g) under such a measuring condition that the diameter of a piston is 10 (mm), the diameter of a nozzle is 1 (mm), the speed of 20 (m/min) and a take-over speed is 20 (m/min).;COPYRIGHT: (C)2004,JPO
机译:要解决的问题:提供用于化学压花的树脂基体;化学压花的压延无卤树脂片的制造方法。特别是一种无卤地板材料,通过开发所谓的化学压花技术,可将泡沫和非泡沫部件同步成图案,从而增强了三维感,质量感和设计效果。;解决方案:该树脂基体用于化学压花包含一种非卤素树脂,在该温度下,其剪切速率为10(1 / S)时在200℃下的熔体粘度为5,000-8,000(Pa.s),在200℃下的熔体张力为5-10(g)。测量条件为:活塞的直径为10(mm),喷嘴的直径为1(mm),速度为20(m / min),接管速度为20(m / min)。版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2003292695A

    专利类型

  • 公开/公告日2003-10-15

    原文格式PDF

  • 申请/专利权人 FUKUVI CHEM IND CO LTD;

    申请/专利号JP20020096082

  • 发明设计人 OTANI YUKIHIRO;

    申请日2002-03-29

  • 分类号C08L23/08;B29C44/00;B32B27/32;C08J5/18;C08J9/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:21:16

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