首页> 外国专利> THERMOPLASTIC RESIN SHEET FOR EMBOSS TRANSFER, THERMOPLASTIC RESIN EMBOSSED SHEET AND METHOD FOR MANUFACTURING THERMOPLASTIC RESIN EMBOSSED SHEET

THERMOPLASTIC RESIN SHEET FOR EMBOSS TRANSFER, THERMOPLASTIC RESIN EMBOSSED SHEET AND METHOD FOR MANUFACTURING THERMOPLASTIC RESIN EMBOSSED SHEET

机译:用于压印转移的热塑树脂板,热塑树脂压制板和制造该热塑树脂压制板的方法

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin sheet for emboss transfer, which can manufacture a thermoplastic resin embossed sheet with high coefficient of transfer.;SOLUTION: The thermoplastic resin sheet 11 for emboss transfer includes a laminar structure with the base material layer 11A of a thermoplastic resin and a transfer surface layer 11B to be laminated on the base material layer 11A. The transfer surface layer 11B is structured at least, with either a glass transition point (Tg) showing at least 1°C lower than the glass transition point (Tg) of the base material layer 11A or with the addition of an easy lubricative additive. The base material layer 11A has a glass transition point (Tg) of 50°C to 200°C. The thermoplastic resin embossed sheet 11 is manufactured by transferring an embossed pattern to the surface of a transfer layer 11B.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供用于压花转印的热塑性树脂片,其可以制造具有高转印系数的热塑性树脂压花片。;解决方案:用于压花转印的热塑性树脂片11包括具有基材层11A的层状结构。在基材层11A上层叠热塑性树脂和转印表面层11B。转印表面层11B至少构成为具有比基材层11A的玻璃化转变点(Tg)低至少1℃的玻璃化转变点(Tg),或者添加了易润滑的添加剂。基材层11A的玻璃化转变温度(Tg)为50℃至200℃。通过将压纹图案转印到转印层11B的表面上来制造热塑性树脂压纹片材11 。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2010253696A

    专利类型

  • 公开/公告日2010-11-11

    原文格式PDF

  • 申请/专利权人 IDEMITSU UNITECH CO LTD;IDEMITSU KOSAN CO LTD;

    申请/专利号JP20090103173

  • 发明设计人 TADA KEISHI;ITO KAZUYA;FUNAKI AKIRA;

    申请日2009-04-21

  • 分类号B32B3/30;B29C59/04;B32B33/00;B32B27/30;C08L25/06;C08L69/00;C08K5/20;B29K25/00;B29K69/00;B29L7/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:48

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