Chemical mechanical polishing polishing head pressure is such that for a plurality of controllable regions comprise a wafer sub-carrier and a floating-type wafer retaining ring

摘要

(57) A structure and method for planarizing or polishing a uniform substrate such as a semiconductor wafer, [Abstract] The present invention is substantially uniform between the edge and center of the semiconductor wafer I will provide a structure and method that can provide a polishing. In aspect of the present invention, a retaining ring, which is a sub-carrier for mounting a housing, a substrate to be polished, and that substantially surrounds the sub-carrier, the retaining ring is movable relative to the subcarrier a first coupling for doing so is to attach to the sub-carrier retaining ring, sub-carriers and to be movable relative to the housing, the first for attachment to the housing sub-carrier I have provided, and a second coupling.