METHOD AND APPARATUS FOR SEPARATING/CLEANING OF WAFERLIKE WORK

摘要

PROBLEM TO BE SOLVED: To provide a technique by which wafers adhered to each other at a sliced stage can be separated and cleaned easily and simply.;SOLUTION: The separating and cleaning apparatus is constituted in such a way that a wafer material 1 is fixed and bonded to a block B, that the wafer blank 1 is sliced to form each waferlike work W and that respective wafers 2 formed by its slicing operation are separated from each other by a separation means 5 so as to be cleaned. The apparatus is constituted in such a way that a flow channel 6 for a cleaning liquid Q is installed in the block B, that the wafer material 1 is sliced, that each sliced gap S in the wafer material 1 is made to communicate with the flow channel 6 for the cleaning liquid Q and that the cleaning liquid Q can be circulated in each sliced gap S.;COPYRIGHT: (C)2003,JPO