COVER MEMBER OF HYBRID INTEGRATED CIRCUIT MODULE AND HYBRID INTEGRATED CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a cover member of a hybrid integrated circuit device in which a space can be saved.;SOLUTION: In the cover member 20 formed into box shape by a ceiling plate 21 and a plurality of wall plates 22 and 28 above a substrate 10 on which a hybrid integrated circuit is formed, lower end parts of a pair of opposite wall plates 22 can be located on the outside of a side face of the substrate 10 having a castellation 14, and the wall plate 28 can be secured to the surface of the substrate 10 such that the lower end face of the wall plate 28 other than the pair of wall plates 22 can abut against the surface of the substrate 10. When the lower end face of the wall plate 28 abuts against the surface of the substrate 10, the lower end parts of the pair of wall plates 22 can be located higher than the bottom face of the substrate 10, and a protrusion 24 engaging with the castellation 14 in the side face of the substrate 10 is formed on the inner face of each of the pair of wall plates 22.;COPYRIGHT: (C)2003,JPO