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Optical process amendment of the rational IC mask layout which is due to the reuse of amendment

机译:合理的IC掩膜版图的光学工艺修正,这是由于修正的重复使用

摘要

(57) Abstract The EDA tool, when being decided, that the 2nd field, is the 1st field and equivalence with the purpose of OPC, reuses the amendment which is decided vis-a-vis that 1st field, with respect to the 2nd field, optical and/or the OPC module which runs process preliminary compensation is had with rational manner vis-a-vis IC mask layout. OPC module in every field, runs amendment vis-a-vis IC mask layout, as for that amendment, with one execution configuration, repeatedly using the model based simulation which includes resist model based simulation and optical model based simulation, decides.
机译:(57)<摘要> EDA工具在被确定为第二字段是第一字段且等同于OPC时,相对于第一字段重新使用针对第一字段而确定的修正案。相对于IC掩模布局,第二场,光学和/或运行过程预补偿的OPC模块具有合理的方式。 OPC模块在每个领域中都对IC掩模布局进行了修正,针对该修正,采用一种执行配置,反复使用基于模型的仿真(包括基于抗蚀剂模型的仿真和基于光学模型的仿真)进行决策。

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