COMPOSITION FOR GLASS-CERAMICS, HIGH DIELECTRIC GLASS- CERAMICS SUBSTRATE, AND CERAMICS MULTILAYER WIRING BOARD WITH BUILT-IN CAPACITOR

摘要

PROBLEM TO BE SOLVED: To provide a lead-free composition for glass-ceramics which is burnable at a low temperature of ≤1,000°C, to provide a lead-free high dielectric glass-ceramics substrate which has a high dielectric constant and a low dielectric loss, and to provide a ceramics multilayer wiring board with a built-in capacitor.;SOLUTION: The composition for glass-ceramics consists of, by weight, 45 to 80% borosilicate aluminum glass and a 20 to 55% filler, and does not contain lead in the composition. The borosilicate aluminum glass contains 30 to 75% of one or more kinds selected from the group consisting of BaO, SrO and CaO, and, as the filler, titanium oxide is contained. The composition for glass- ceramics is molded and burned to form into the high dielectric glass-ceramics substrate.;COPYRIGHT: (C)2003,JPO