首页> 外国专利> FORMING METHOD FOR AXIAL LEAD-TYPE ELECTRONIC COMPONENT, METAL MOLD FOR USE THEREIN, AND AXIAL LEAD-TYPE ELECTRONIC COMPONENT

FORMING METHOD FOR AXIAL LEAD-TYPE ELECTRONIC COMPONENT, METAL MOLD FOR USE THEREIN, AND AXIAL LEAD-TYPE ELECTRONIC COMPONENT

机译:轴铅型电子部件的形成方法,其中使用的金属模和轴铅型电子部件

摘要

PROBLEM TO BE SOLVED: To prevent deformation in a right-angled shoulder portion previously formed by folding in a lead wire.;SOLUTION: When a flat portion 15 for positioning is formed in lead wires 11a and 11b by press work, a movable positioning stopper portion 22 for absorbing elongation of the lead wires 11a and 11b which elongation develops on the resin body portion 21 side of the lead wires is formed as an outer wall of a housing 5, in which the resin body portion 12 of an axial lead-type electronic component 10 is to be placed.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:为了防止先前通过折叠导线而形成的直角肩部变形;解决方案:当通过冲压加工在导线11a和11b中形成用于定位的平坦部分15时,可移动的定位限位器在壳体5的外壁上形成有用于吸收在引线的树脂主体部21侧产生的伸长的引线11a,11b的伸长的承受部22,在壳体5的外壁形成有轴向引线型的树脂主体部12。电子元件10将被放置。版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2002329827A

    专利类型

  • 公开/公告日2002-11-15

    原文格式PDF

  • 申请/专利权人 NIPPON INTER ELECTRONICS CORP;

    申请/专利号JP20010134777

  • 发明设计人 TSUCHIYA AKIKAZU;OCHITANI ATSUSHI;

    申请日2001-05-02

  • 分类号H01L23/48;

  • 国家 JP

  • 入库时间 2022-08-22 00:16:25

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