首页> 外国专利> Two rows lead-type electronic component mounting printed circuit board , two rows soldering method of the lead -type electronic component , an air conditioner

Two rows lead-type electronic component mounting printed circuit board , two rows soldering method of the lead -type electronic component , an air conditioner

机译:两排安装有铅型电子元件的印刷电路板,两排焊接方法的铅型电子元件,空调

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board for surely preventing solder bridges and solder chips and also preventing defective soldering work, particularly even when a narrow pitch is provided between leads in soldering the double-lead type electronic component by the jet type soldering method.;SOLUTION: In the printed circuit board 1, soldering lands are arranged for connection of each lead of the double-lead type electronic component 2 by the jet type soldering method and a soldering land 4 is provided for adhesion of excessive solder during the soldering process at the rear part of the last soldering land 3h in the progressing direction of the jet type soldering method. The soldering land 4 is formed to have a square external shape and includes a slit 4a formed in the shape being bent internally. One corner of the square shape is arranged between the leads near the last soldering land 3h and the bending part of the slit is arranged near the corner.;COPYRIGHT: (C)2010,JPO&INPIT
机译:要解决的问题:提供一种印刷电路板,以确保防止焊料桥和焊料芯片,并防止不良的焊接工作,尤其是在通过喷射式焊接方式焊接双引线型电子元件时,即使引线之间的间距很小也是如此。解决方案:在印刷电路板1中,设置焊接区以通过喷射式焊接方法连接双引线型电子元件2的每条引线,并提供焊接区4以便在焊接期间粘附过多的焊料。在最后的焊接区3h的后部沿喷射式焊接方法的进行方向进行焊接过程。焊接区4形成为具有正方形的外部形状,并且包括形成为内部弯曲的形状的狭缝4a。在最后一个焊接区3h附近的引线之间布置正方形的一个角,在该角附近布置狭缝的弯曲部分。;版权所有(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP5599151B2

    专利类型

  • 公开/公告日2014-10-01

    原文格式PDF

  • 申请/专利权人 三菱電機株式会社;

    申请/专利号JP20090019388

  • 发明设计人 三浦 剛;

    申请日2009-01-30

  • 分类号H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 16:13:58

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