首页> 外国专利> METHOD FOR FORMING SEMICONDUCTOR MICROSTRUCTURE AND SEMICONDUCTOR ELEMENT FORMED USING THAT METHOD, METHOD FOR FABRICATING RESONANCE TUNNEL ELEMENT AND RESONANCE TUNNEL ELEMENT FABRICATED USING THAT METHOD

METHOD FOR FORMING SEMICONDUCTOR MICROSTRUCTURE AND SEMICONDUCTOR ELEMENT FORMED USING THAT METHOD, METHOD FOR FABRICATING RESONANCE TUNNEL ELEMENT AND RESONANCE TUNNEL ELEMENT FABRICATED USING THAT METHOD

机译:用该方法形成的半导体微结构和半导体元件的形成方法,制造谐振隧道元件的方法和使用该方法制造的谐振隧道元件

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a semiconductor microstructure of narrow width with good controllability.;SOLUTION: The method for forming a semiconductor microstructure 104 comprises a step for forming mask patterns 103 and 203 having a first opening 221 and a second opening 222 on a substrate having a semiconductor layer 204 formed thereon, and a step for forming the semiconductor microstructure 104 extending in a first direction parallel with the surface of the substrate by etching the semiconductor layer 204 selectively. In the etching step, etching rate in a second direction perpendicular to the first direction and parallel with the surface of the substrate is substantially zero for etching rate in the first direction, and the width m of the semiconductor microstructure 104 is substantially identical to the shortest distance M between the first opening 221 and the second opening 222 in the second direction.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种形成具有良好可控性的窄宽度的半导体微结构的方法;解决方案:形成半导体微结构104的方法包括形成具有第一开口221和第二开口的掩模图案103和203的步骤。在其上形成有半导体层204的衬底上形成开口222,以及通过选择性地蚀刻半导体层204来形成在与衬底的表面平行的第一方向上延伸的半导体微结构104的步骤。在蚀刻步骤中,对于在第一方向上的蚀刻速率,在垂直于第一方向并且平行于衬底表面的第二方向上的蚀刻速率基本上为零,并且半导体微结构104的宽度m基本上等于最短的宽度。第一开口221和第二开口222在第二方向上的距离M。版权所有:(C)2003,JPO

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