首页> 外国专利> ANISOTROPIC ETCHING METHOD FOR SILICON CRYSTAL, METHOD OF MANUFACTURING INK CHANNEL PLATE, INK CHANNEL PLATE, INK-JET PRINT HEAD, AND INK JET PRINTER

ANISOTROPIC ETCHING METHOD FOR SILICON CRYSTAL, METHOD OF MANUFACTURING INK CHANNEL PLATE, INK CHANNEL PLATE, INK-JET PRINT HEAD, AND INK JET PRINTER

机译:硅晶体的各向异性刻蚀方法,墨道板,墨道板,喷墨打印头和喷墨打印机的制造方法

摘要

PROBLEM TO BE SOLVED: To etch the bottom face of an ink pool well and to block a refined thin-film mask pattern at the opening of the ink pool. ;SOLUTION: A method of manufacturing an ink channel plate includes a process for forming a layer on a single crystal silicon substrate 2 as a sacrificial layer 5, a process for forming a thin-film mask pattern 4 having an aperture with a width on the order of several micrometers on the sacrificial layer 5, a process for removing the sacrificial layer 5 using a silicon crystal anisotropic chemical etching solution 6 to form a cavity between the thin-film mask pattern 4 and the single crystal silicon substrate 2 and for chemically etching the single crystal silicon substrate 2, and a process for forming a protective film 12 closing the thin-film mask pattern 4. The sacrificial layer 5 is made of a material that can be selectively etched at a speed higher than the speed at which the single crystal silicon substrate 2 is etched.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:蚀刻墨水池的底面,并在墨水池的开口处堵塞精致的薄膜掩模图案。 ;解决方案:一种墨水通道板的制造方法包括在单晶硅基板2上形成一层作为牺牲层5的工艺,在其上形成具有一定宽度的孔的薄膜掩模图案4的工艺。在牺牲层5上的数量级为几微米的级数,使用硅晶体各向异性化学蚀刻溶液6去除牺牲层5以在薄膜掩模图案4和单晶硅衬底2之间形成空腔并进行化学蚀刻的过程该单晶硅衬底2,以及用于形成封闭薄膜掩模图案4的保护膜12的工艺。牺牲层5由可以以高于单晶硅的速度的选择性腐蚀的材料制成。蚀刻晶体硅衬底2;版权所有(C)2003,JPO

著录项

  • 公开/公告号JP2003053700A

    专利类型

  • 公开/公告日2003-02-26

    原文格式PDF

  • 申请/专利权人 FUJI XEROX CO LTD;

    申请/专利号JP20010248172

  • 发明设计人 YAGI TAKASHI;

    申请日2001-08-17

  • 分类号B81C1/00;B41J2/16;B81B1/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:15:04

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