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POROUS SILICON OXIDE THIN FILM AND PRODUCTION METHOD THEREFOR

机译:多孔氧化硅薄膜及其制备方法

摘要

PROBLEM TO BE SOLVED: To form a silicon oxide thin film which has a controlled porous structure. ;SOLUTION: A copolymer thin film is deposited by plasma polymerization of a gaseous mixture of a silicon-based monomer and a hydrocarbon-based monomer in a fixed ratio. After that, the copolymer thin film is further treated by an electric discharge with oxygen or an oxygen-containing gas as a plasma source, and the polymer component originated from the hydrocarbon-based monomer is removed by etching, and simultaneously, the silicon-based polymer part is oxidized and converted into silicon oxide to obtain the porous silicon oxide thin film.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:形成具有受控的多孔结构的氧化硅薄膜。 ;解决方案:共聚物薄膜是通过等离子聚合固定比例的硅基单体和烃基单体的气体混合物而沉积的。之后,通过用氧气或含氧气体作为等离子体源通过放电对共聚物薄膜进行进一步处理,并且通过蚀刻去除源自烃类单体的聚合物成分,并且同时进行基于硅的物质的蚀刻。将聚合物部分氧化并转化为氧化硅,得到多孔氧化硅薄膜。;版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2003054934A

    专利类型

  • 公开/公告日2003-02-26

    原文格式PDF

  • 申请/专利号JP20010250784

  • 发明设计人 HIROTSU TOSHIHIRO;

    申请日2001-08-21

  • 分类号C01B33/12;B01D67/00;B01D71/02;B01J20/10;B01J20/30;C08G83/00;C08J7/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:14:48

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