首页> 外国专利> MOTHER DIE FOR MODULE ELECTROFORMING AND METHOD FOR DUPLICATION BY ELECTROFORMING

MOTHER DIE FOR MODULE ELECTROFORMING AND METHOD FOR DUPLICATION BY ELECTROFORMING

机译:用于模块电铸的母模和通过电铸复制的方法

摘要

PROBLEM TO BE SOLVED: To realize the reduction in mass and the improvement in machinability and handleability by divided processing of only a shape transfer region by devising a method for duplication by electroforming excellent in shape transfer quality, an electroforming die structure of uniform electrodepositability, an inexpensive electroforming die making method, or the like.;SOLUTION: The mother die for module electroforming is one which is capable of being assembled from several blocks prepared by dividing a shape transfer region on which a fine pattern is formed and a region surrounding it and in which the shape transfer surface lies level to the blocks. Because the shape transfer region on which a fine pattern is formed is surrounded by other mother die blocks and the shape transfer region and the electroforming surface of the surrounding block form a level plane, the shape transfer region has no unlevelness around it. Therefore, concentrated deposition on the outer periphery of the shape transfer region does not occur and a plating layer uniform throughout the entire surface of the shape transfer region can be formed. As a result, the deterioration in transfer quality by concentrated deposition causing the warpage or deformation of the plating layer in the transfer region does not occur.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:通过设计形状转移质量优异的电铸复制方法,电沉积性均匀的电铸模具结构,解决方案:解决方案:用于模块电铸的母模是一种能够由几个模块组装而成的模块,这些模块是通过将形成精细图案的形状转印区域及其周围区域划分为几个区域而制成的。其中,形状传递表面位于块的水平线上。因为其上形成有精细图案的形状转印区域被其他母模块围绕,并且该形状转印区域和包围块的电铸表面形成水平平面,所以该形状转印区域在其周围没有不平整。因此,不会在形状转印区域的外周上发生集中的沉积,并且可以形成在形状转印区域的整个表面上均匀的镀层。结果,不会发生由于浓缩沉积而引起的转印质量下降,而引起转印区域的镀层翘曲或变形。COPYRIGHT:(C)2003,JPO

著录项

  • 公开/公告号JP2003129269A

    专利类型

  • 公开/公告日2003-05-08

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20010320253

  • 发明设计人 IKEDA KUNIO;

    申请日2001-10-18

  • 分类号C25D1/10;B29C33/38;C25D1/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:13:23

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