OPTICAL CHARACTERISTIC MEASUREMENT MASK, OPTICAL CHARACTERISTIC MEASUREMENT METHOD, ADJUSTMENT METHOD OF PROJECTION OPTICAL SYSTEM AND MANUFACTURING OF ALIGNER

摘要

PROBLEM TO BE SOLVED: To provide an optical characteristic measurement mask which realizes reduction of the measuring time. SOLUTION: A measurement mask RT has a mask substrate 60, wherein a plurality of patterns 67i ,j are arranged, and an opening plate 66 wherein pin hole openings 70i ,j which are disposed in a projection side of the substrate and correspond to each pattern individually are formed. The permeability of a light screening part of each pattern is set to allow light partially to pass through. Therefore, when a mask RT is arranged on an object surface and is illuminated with illumination light, illumination light projected from a pattern is projected to a resist layer on a wafer on an image surface via each pin hole opening and a projection optical system PL and a pattern is transferred to a resist layer. In the process, any small amount of the light from a light screening part, which essentially screens light, reaches a wafer and accelerates optical sensing of resist of a wafer surface. Therefore, the exposure time for obtaining a pattern transfer image of an aimed line width and furthermore a measurement time of optical characteristic of a projection optical system can be reduced.