PHOTOSENSITIVE FLUX AND SOLDER JOINT PART USING THE SAME, FLIP CHIP, SEMICONDUCTOR PACKAGE, AND PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive flux by which an appropriate quantity of flux can be stably supplied to a solder joint part without any variance, a remaining flux after solder joint is unnecessary to be rinsed for removal, and solder joint with high joint strength and reliability can be realized.;SOLUTION: This photosensitive flux enables photopatterning and has an adhesivity to solder, and it works as a flux during solder joint and functions as a resin reinforcing material through heating and curing. The flux is made by mixing a resin (A) having at least one or more phenolic hydroxyl group, an epoxy resin, an isocianate resin or the like, a resin (B) working as its curing agent, a compound (C) having at least one or more optical functional group, and a photopolimerization starting agent (D), as essential elements.;COPYRIGHT: (C)2003,JPO