首页> 外国专利> Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board

Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board

机译:具有通孔的突起的印刷掩模,用于在印刷电路板上的焊盘上印刷焊膏

摘要

A printing mask has protrusions having through holes defined therein for printing a solder paste on lands on a printed circuit board. The protrusions serve to increase the amount of solder paste filled in the through holes.
机译:印刷掩模具有在其中限定的通孔的突起,用于在印刷电路板上的连接盘上印刷焊膏。突起用于增加填充在通孔中的焊膏的量。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号